Along with the mature high-definition video display technology, people have higher expectations on audio/video experience today. For consumer electronics (CE) devices and home entertainment products, supporting HD audio/video transmission has become an essential requirement. However, while the tendency of mobile devices’ form factor is smaller and smaller, making a product design embedded HD signal transmission interface has become challenging than ever. Also, the high power consumption of HD signal transmission is also a key element that impact the standby time of mobile devices. With these above situation and the increasing needs of mobile audio /video streaming, the latest mobile HD connectivity technical standard – MHL (Mobile High-Definition Link) is therefore released.
Thunderbolt, formerly called ‘Lightpeak’, is Intel’s new high-speed I/O technology through a single port that is first available on new Apple MacBook Pro notebooks lately. Fast data transfers are Intel’s main claim, such as 10 gigabits per second transfers and dual-protocol support. The dual-channel design allows for two channels on the same connector at up to 10 gigabits per second that can support both PCI Express and DisplayPort technologies. Compared with existing technologies, Thunderbolt is regarded as a combination of HDMI and USB 3.0, the loading quantity is spectacularly huge through its co-invented PCI Express 4x, which can connect external devices directly to Macbook Pro.
Along with the fast-growing technology, technology standardization is not only promoting technology development but also providing a clear purchase direction to consumers.
According to today’s market, Allion Test Labs has collected six top industry standards and specifications here below, which includes Microsoft Windows, USB, Wi-Fi, HDMI, DisplayPort and SATA. In the first article, we will introduce the first three industry standards.
The Intel Developer Forum (IDF) in San Francisco this year was a wild success. The three-day conference combined the brightest minds from companies across the globe, showcasing the latest trends and technologies in the field. Here are a few of the highlights from this year’s conference:
- Growth of Smart-Device Market: Intel CEO Paul Otellini focused his keynote presentation on the growing smart device market. He also highlighted Intel’s upcoming Sandy Bridge processors, Intel’s first mainstream chip integrating graphics function and main processor on the same piece of silicon.
- Wireless Displays (WiDi): Continuing the trend of consumer product interoperability, wireless display technology allows users to mirror their PC’s display to an HDTV, no wires required. Intel Atom processors will soon feature integrated WiDi technologies for netbooks and tablets.
- WeTab: The WeTab, developed by Neofonie and 4tiitoo, is the first tablet running the MeeGo operating system. The tablet offers a flexible user interface and Intel’s high-powered Atom processor. No global release date has been announced.
- SuperSpeed USB Momentum: The USB Implementers Forum (USB-IF) announced that almost 120 products have passed SuperSpeed USB (USB 3.0) certification testing, demonstrating strong industry momentum since the first SuperSpeed USB-certified device was announced at IDF 2009.
- Context-Aware Devices: Justin Rattner, Intel’s chief technology officer and director of Intel Labs, presented a keynote on Wednesday on how personal technology will transform the way consumers interact with technology. Whether it’s cameras detecting movement or analyzing inputted data, such as calendar information, this next wave of devices will anticipate users’ wants and needs.
Learn More:
- Upcoming Event: Intel Developer Forum
- SuperSpeed USB Adoption Poised to Take Off
- MeeGo has Coming-Out Party at IDF Beijing
This week at Intel Developer Forum (IDF) in San Francisco, Allion will be exhibiting in the SuperSpeed USB Community, hosted by the USB Implementers Forum. During IDF, more than 150 leading companies from around the world will showcase the latest innovations and future technologies. We are looking forward to seeing what’s in store and reporting back on the highlights of this year’s show.
If you are planning to attend IDF, we invite you to stop by our booth. Allion currently offers the following USB tests and test tools:
- USB-IF Logo Compliance Program: (Full/Hi-Speed/OTG) – Offering test consultation, test expertise, test environment, and certified test engineers for product vendors to achieve USB certified logo.
- USB Interoperability Test: Allion has up to 5000+ brand name PC systems and USB devices as the In-House test bed to help vendors verify quality level and compatibility with other third-party devices.
- USB Battery Charging Port Test: Allion’s patented test methodology to verify device Power Consumption, Over Shoot, Under Shoot, Short-Recover Time and more features relating to the Battery Charge.
- USB 3.0 Compliance Pre-Test: Electrical and Protocol testing services are currently available.
- USB Test Tools: Series of USB Test Fixtures (Sets) are available to make developers’ internal test efficient and effective.
With all the benefits of SuperSpeed USB (USB 3.0) – including faster speeds, bidirectional data interface and lower power consumption – consumers are eager to adopt this cutting-edge technology. Until this point, one of the main hurdles slowing widespread adoption has been the price of chips. However, NEC, the first company to ship a SuperSpeed USB host controller, is looking to change that. The company reportedly plans to significantly reduce prices for its first- and second-generation USB 3.0 chips later this year.
NEC’s third-generation USB chip models are scheduled to start shipping in Q1 2010, priced at less than $2. Other companies, including ASMedia (an Asus subsidiary), Etron, VIA and Fresco Logic, have all introduced price cuts for SuperSpeed USB products as well, with ASMedia dipping as low as $1.70 per chip for bulk orders.
Market watchers are predicting that 20 million SuperSpeed USB chips will ship by the end of the year, followed by 40 million shipments in 2011. With these dramatic price drops and a growing number of USB 3.0 certified devices, it’s likely that consumers won’t have to wait much longer for widespread adoption.
Lower prices and an increasing number of shipments mean manufacturers have the tools they need to take advantage of the demand for lower-cost SuperSpeed USB products. But despite the falling price of chips, developers still need to be aware of the costs associated with test development and product design validation. By pairing with a certified product development and testing company such as Allion, offering end-to-end validation solutions, developers can improve time-to-market and reduce overall costs, a savings which can then be passed on to consumers eagerly awaiting new SuperSpeed USB devices.
Learn More:
- SuperSpeed USB Adoption Poised to Take Off
- SuperSpeed USB Continues Growth at Devcon
- DisplayPort and USB 3.0 Named Among Top Technologies of 2010
Unless you purchased a computer within the last few months, chances are you do not yet have SuperSpeed USB (USB 3.0) ports on your computer. For those who want to take advantage of the new technology but are not yet willing to invest in a new PC, TRENDnet is offering a cost-effective alternative: SuperSpeed USB upgrade solutions for both desktop PCs and laptops.
TRENDnet has released two user-friendly adapters that allow consumers to take advantage of the latest USB technology. For laptop users, TRENDnet has developed the 2-port USB 3.0 ExpressCard Adapter model TU3-H2EC. Desktop users can take advantage of the 2-Port USB 3.0 PCI Express Adapter model TU3-H2PIE. Both models are fully compatible with Windows-based machines. The adaptors will soon be available for $59 and $49, respectively.
SuperSpeed USB offers a number of compelling enhancements over its predecessor, USB 2.0. Among the most notable is the speed: SuperSpeed USB delivers data transfer rates up to 5 Gbps, 10x faster than USB 2.0. The standard contains nine bi-directional wires, compared to the four unidirectional wires in USB 2.0, improving data transfer compatibilities. SuperSpeed USB also improves power efficiency, allowing for extended battery life for portable devices. SuperSpeed USB is backward compatible with the billions of USB devices currently on the market.
An authorized USB-IF Compliance Program testing lab, Allion has years of experience working with product developers. Our labs offer comprehensive development, validation and support services for hardware vendors looking to design products based on the USB specification. Allion has the USB service capabilities and expertise to help manufacturers develop the highest quality products so that consumers can advantage of SuperSpeed USB capabilities.
Learn More:
- SuperSpeed USB Adoption Poised to Take Off
- SuperSpeed USB Continues Growth at Devcon
- DisplayPort and USB 3.0 Named Among Top Technologies of 2010
For consumers looking for the latest technology, SuperSpeed USB (USB 3.0) offers an exciting combination of speed and performance – up to 10x faster than Hi-Speed USB (USB 2.0), optimized power efficiency and increased power delivery – and there have been a growing number of SuperSpeed USB products entering the market. According to a series of new market analyses from In-Stat, consumers won’t have much longer to wait for widespread SuperSpeed USB adoption.
In-Stat projected that the PC market will completely transition from Hi-Speed USB to SuperSpeed USB by 2014. While desktops have historically been the first to adopt new interface technologies, SuperSpeed USB adoption is expected to be driven by mobile PCs, reflecting the need for faster interfaces for external storage solutions. SuperSpeed USB is projected to take off in 2011, sweeping through the USB-enabled hard drive market by 2013. SuperSpeed USB devices will also become more affordable as shipments increase: From 2009 to 2014, prices for USB-enabled devices are projected to decrease by more than 20 percent each year.
For manufacturers, SuperSpeed USB presents a growing market with huge potential for development. Allion Test Labs has been an accredited USB-IF Independent Test Lab (ITL) since 1999, offering complete engineering, validation and compliance testing for every stage of the product design and development process. With Allion’s expertise and USB test service capabilities, manufacturers are offered a one-stop shop for product development that allows them to get quality products to market faster and take advantage of SuperSpeed USB’s growing market.
Learn More:
- SuperSpeed USB Continues Growth at Devcon
- Comparing USB 2.0 and USB 3.0
- Test Labs for USB Solutions that Go Beyond Testing
This week, Allion Japan announced with Tektronix, Inc. that they will implement Tektronix test and measurement solutions supporting HDMI 1.4a and SuperSpeed USB in their certification test services. As one of the first compliance test labs to conduct certification testing for HDMI 1.4a and USB 3.0 in one facility, this is an exciting development for Allion.
Read the complete announcement.
Seventy-five devices have passed SuperSpeed USB certification, the USB Implementers Forum (USB-IF) announced at the SuperSpeed USB Developers Conference (Devcon) April 1-2 in Taipei, Taiwan. The conference highlighted the growing variety of SuperSpeed USB certified devices, with emerging device classes such as monitors and printers incorporating SuperSpeed USB hubs.
The SuperSpeed USB Devcon featured keynotes from the USB-IF leadership, providing attendees with a comprehensive SuperSpeed USB update and valuable information on incorporating SuperSpeed USB into devices. This year’s keynote speakers included Jeff Ravencraft, president and chair of USB-IF, and Lee Atkinson, distinguished technologist, HP.
It’s clear that SuperSpeed USB is drawing industry attention. SuperSpeed USB’s blazing transfer speed—10x that of Hi-Speed USB (USB 2.0)—and two-way data transfer capabilities create exciting new possibilities, such as driving two or more displays at full 1080p resolution while simultaneously reading data from external disk drives. With its continued industry momentum and the number of SuperSpeed USB certified devices up 50 percent in the last month, this technology is taking the first steps toward seeing the same ubiquity as its predecessor, USB 2.0.
“SuperSpeed USB is tracking with [International Data Corporation] IDC’s forecast from last year for its adoption,” said Shane Rau, director of IDC’s Computing and Storage Semiconductors research, in a recent release. “Driven by the need for more and faster data storage capabilities in PCs, we continue to forecast that SuperSpeed USB will ship in 45 percent of mobile PCs in 2010.”
Learn More:
- First Certified SuperSpeed USB Consumer Products Announced
- DisplayPort and USB 3.0 Named Among Top Technologies of 2010
